Thermoelectric module with interarray bridges

ABSTRACT

A thermoelectric module is capable of successfully reducing the heat stress for increased reliability. The module includes a plurality of thermoelectric chips of P-type and N-type arranged in a matrix between sets of first and second contacts to form a series electrical circuit. The chips are arranged to give at least three chip arrays each having a limited number of the chips. A first carrier is provided on one side of the chips to carry the first contacts and to include first bridges each integrally joining two adjacent first contacts to define first discrete couples for electrical connection of the chips in each chip array. The first carrier further includes at least two inter-array bridges which are solely responsible for electrical interconnection between the adjacent chip arrays. On the opposite side of the chips, there are formed a plurality of second bridges each integrally joining the two adjacent second contacts to give second discrete couples for electrical connection of the two adjacent chips in each of the chip arrays. Thus, the inter-array bridges are formed only on one side of the chips for interconnection of the first contacts between the adjacent chip arrays. Therefore, the heat stress applied to the end of the chip array where the two adjacent chip arrays are interconnected can be well relieved on the side of the second contacts in which the second discrete couples are kept totally isolated from each other.

This is a Division of application Ser. No. 09/200,972 filed Nov. 30,1998. The discloser of the prior application(s) is hereby incorporatedby reference herein in its entirety.

BACKGROUND ART

1. Field of the Invention

The present invention relates to a thermoelectric module and a method offabricating the thermoelectric module having a matrix of seriesconnected thermoelectric chips for use in a heat-exchange system.

2. Description of the Prior Art

WO 97/45882 discloses a prior thermoelectric module having a matrix ofthermoelectric chips which are arranged between a set of first contactsand a set of second contacts to form a series electric circuit. Thecircuit is composed of a plurality of linear arrays each having alimited number of the chips of P-type and N-type arranged alternatelyalong a column of the matrix and are bonded on one face of the chips tothe individual first contacts and bonded on the opposite face to theindividual second contacts. The two adjacent first contacts in eachlinear array are connected to form first discrete couples, while the twoadjacent second contacts are likewise connected to form second discretecouples. Thus, the chips in the individual linear arrays are connectedin series to form sub-circuits. The sub-circuits are electricallyinterconnected by means of first and second inter-array bridges whichare formed respectively on the sides of the first and second contacts toextend across the two first and second contacts of the adjacent lineararrays, respectively. Thus, the chip at one end of the linear array isrestricted on its one side by the first or second couples in the singlearray and also restricted on the opposite side by the second or firstinter-array bridges extending across the two adjacent arrays.

Generally, the thermoelectric module is utilized with the set of thefirst contacts rigidly mounted on a supporting structure and with theset of the second contacts in rather soft contact with a heating orcooling member. Therefore, heat stress developed at the individual chipsduring the use is better to be relieved on the side of the secondcontacts rather than on the side of the first contacts rigidly mountedon the supporting structure. Nevertheless, the presence of the secondinter-array bridge utilized in the above prior art becomes a certainhindrance to relieving the heat stress on the side of the secondcontacts. That is, the adjacent arrays or sub-circuits of the chips arerestricted to each other by the second inter-array bridge so that heatstress is difficult to be relieved on the side of the second contacts,thereby sometimes resulting in undesired fracture or crack in the chipat the end of the array which is restricted on the opposite sidesthereof in the two different directions one along the individual arrayand the other crossing therewith.

SUMMARY OF THE INVENTION

The present invention has been accomplished in view of the above problemand has a primary object of providing an improved thermoelectric modulewhich is capable of successfully reducing the heat stress for increasedreliability. The thermoelectric module in accordance with the presentinvention includes a plurality of thermoelectric chips of P-type andN-type arranged in a matrix between a set of first contacts and a set ofsecond contacts to form a series connected electrical circuit which isadapted to flow an electric current therethrough for heating one side ofthe first and second contacts while cooling the other side of the firstand second contacts due to the Peltier effect at the chips. The chipsare arranged to give at least three chip arrays each having a limitednumber of the chips. A first carrier is provided on one side of thechips to carry the set of the first contacts and to include firstbridges each integrally joining two adjacent first contacts to definefirst discrete couples for electrical connection of the chips in eachchip array. The first carrier further includes at least two inter-arraybridges which are solely responsible for electrical interconnectionbetween the adjacent chip arrays. The first carrier is fixedly mountedon a rigid substrate so as to restrain the first discrete couples on thesubstrate. On the opposite side of the chips, there are formed aplurality of second bridges each integrally joining the two adjacentsecond contacts to give second discrete couples for electricalconnection of the two adjacent chips in each of the chip arrays. Withthis structural arrangement, the inter-array bridges are formed only onone side of the chips for interconnection of the first contacts betweenthe adjacent chip arrays, while the second contacts are distributed onthe other side of the chips as second discrete couples. Thus, the heatstress applied to the end of the chip array where the two adjacent chiparrays are interconnected can be well relieved on the side of the secondcontacts in which the second discrete couples are kept totally isolatedfrom each other.

Accordingly, it is a primary object of the present invention to providea thermoelectric module which is capable of relieving the heat stressdeveloped in the chips during the use to give a fracture-free ruggedstructure.

In one preferred embodiment, each chip array is defined by the chips,the first contacts, and the second contacts all arranged along eachcolumn of the matrix. The first bridges are first vertical bridges eachintegrally joining the two adjacent first contacts in each column togive the first discrete couples. The inter-array bridges are formed tojoin the two adjacent first contacts in the outermost rows of the matrixto form horizontal couples for electrical interconnection between theadjacent chip arrays. The second bridges are in the form of secondvertical bridges each integrally joining the two adjacent secondcontacts in each column of the matrix to give the second discretecouples so that the second discrete couples arranged along one column ofthe matrix are uniformly staggered with respect to the second discretecouples arrange along the adjacent column of the matrix.

In another preferred embodiment of the present invention, each chiparray is defined by the chips arranged in a pair of the two adjacentrows of the matrix, the first contacts in the corresponding two adjacentrows of matrix, and the second contacts in the corresponding twoadjacent rows of matrix. The first bridges are in the form of firstoblique bridges each integrally joining a pair of two obliquely opposedfirst contacts, one in the one row and the other in the adjacent row togive the first discrete couples. The inter-array bridges are provided tojoin a pair of two vertically opposed first contacts, one in the row ofthe chip array and the other in the row of the adjacent chip array forelectrical interconnection between the adjacent chip arrays. The secondbridges are in the form of second vertical bridges each integrallyjoining the two adjacent second contacts in each column of the matrix togive the second discrete couples which are aligned along the columns aswell as along the rows of the matrix. With this arrangement, the chipsof the P-type and N-type can be arranged alternately along the entirelength of the series circuit over the plural chip arrays without leavingno duplicate couples of the same type at the connection between the chiparrays, thereby providing a tight distribution of the chip within alimited space for improved heat-transfer efficiency.

The present invention also provides an improved method of fabricatingthe thermoelectric module. The method utilizes a plurality ofthermoelectric bars of P-type and N-type to be subsequently separatedinto the thermoelectric chips, a first carrier carrying the set of firstcontacts, and a second conductive plate carrying the set of the secondcontacts. The first carrier includes the first bridges forming the firstdiscrete couples, and includes at least two inter-array bridges whichare solely responsible for electrical interconnection between theadjacent chip arrays. The second conductive plate includes the secondbridges defining the second discrete couples, and includes the secondbeams which integrally connect the second discrete couples in order thatall of the second discrete couples are retained to the second conductiveplate prior to being cut. Firstly, a plurality of the thermoelectricbars of P-type and N-type are placed along the rows of the matrix insuch a manner that P-type bars alternate the N-type bars in a spacedrelation along the column of the matrix. Then, the thermoelectric barsare bonded to the rows of the first contacts as well as to the rows ofthe second contacts to form a pre-assembly of a consolidated structurein which the thermoelectric bars are held between the first and secondcontacts. Thereafter, the thermoelectric bars and the second beams aresimultaneously cut to divide the bars into the individual chips as wellas to isolate the second discrete couples from each other. In thismanner, the cutting can be made after stacking the bars between thefirst carrier and the second conductive plate into the consolidatedstructure so that the thermoelectric module can be obtained from thestacked structure while the latter being held stably during the cutting.

Preferably, the method may utilize the first carrier in the form of afirst conductive plate including first beams for interconnection of thefirst couples within a horizontal plane in which the first contacts arearranged. Each of the first bridges and the inter-array bridge areoffset from the horizontal plane in a direction away from thethermoelectric bars. With the use of this first conductive plate, thefirst discrete couples and the inter-array bridges can be formed fromthe first conductive plate by simultaneously cutting the first beams inaddition to the thermoelectric bars and the second beams. Thus, only onecutting can be enough to divide the thermoelectric bars into the chipsand isolate the second discrete couple out of the second conductiveplate, yet to isolate the first discrete couples out of the firstconductive plate, which facilities the production of the thermoelectricmodule by use of the first and second conductive plates each of unitarystructure.

Further, it is advantageous to use the second conductive sheet in whichthe second beams are aligned in parallel with the column of the matrixand are configured so that the cutting is made through the entire lengthof the second conductive plate along lines in which the second beams arealigned. Therefore, the cutting can be all made from the same directionalong several cutting lines in perpendicular to the length of the barsfor cutting the bars into a plurality of the chips as well as the firstand second conductive plates.

The above method is particularly found advantageous to fabricate aplurality of the thermoelectric modules successively on a singleconsecutive process line. For this purpose, there are provided a firsttape carrying a plurality of the first conductive plates connected byfirst webs and a second tape carrying a plurality of the secondconductive plates connected by second webs. The thermoelectric bars aresecured between the respective pairs of the first and second conductiveplates, after which the first and second beams of each of the first andsecond conductive plates are cut out together with thermoelectric barsto make a plurality of the thermoelectric modules which are connected bythe first and second webs to each other. Then, the first and second websare cut out for separating the individual thermoelectric modules fromeach other.

These and still other objects and advantageous features of the presentinvention will become more apparent from the following description ofthe embodiments when taken in conjunction with the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a partially sectional view of a thermoelectric moduleassembled into a heat-exchange device in accordance with a preferredembodiment of the present invention;

FIG. 2 is a perspective view of the thermoelectric module;

FIG. 3 is a top view of the thermoelectric module;

FIG. 4 is a cross-section taken along line X—X of FIG. 3;

FIG. 5 is a cross-section taken along line Y—Y of FIG. 3;

FIG. 6 is a cross-section taken along line Z—Z of FIG. 3;

FIG. 7 is an exploded perspective view illustrating a base plate, a setof thermoelectric bars, and a top plate which are stacked into apre-assembly of a unitary structure from which the thermoelectric moduleis cut out;

FIG. 8 is a perspective view of the above pre-assembly;

FIG. 9 is a top view of the pre-assembly;

FIG. 10 is a cross-section taken along line X—X of FIG. 9;

FIG. 11 is a cross-section taken along line Y—Y of FIG. 9;

FIG. 12 is a cross-section taken along line Z—Z of FIG. 9

FIG. 13 is a top view of the base plate;

FIG. 14 is a cross-section taken along line X—X of FIG. 13;

FIG. 15 is a cross-section taken along line Y—Y of FIG. 13;

FIG. 16 is a bottom view of the base plate;

FIG. 17 is a schematic view illustrating a continuous process offabricating a plurality of the thermoelectric modules;

FIG. 18 is a top view of a base plate partially embedded in a dielectricsubstrate which may be utilized in the present invention;

FIG. 19 is a cross-section taken along line X—X of FIG. 18;

FIG. 20 is a cross-section taken along line Y—Y of FIG. 18;

FIG. 21 is a top view of a substrate carrying first contacts and firstbridges which may be utilized in the present invention;

FIG. 22 is a cross-section taken along line X—X of FIG. 21;

FIG. 23 is a cross-section taken along line Y—Y of FIG. 21;

FIG. 24 is a top view of a substrate carrying first contacts and firstbridges which may be utilized in the present invention;

FIG. 25 is a cross-section taken along line X—X of FIG. 24;

FIG. 26 is a cross-section taken along line Y—Y of FIG. 24;

FIG. 27 is a partially sectional view of a stack of the thermoelectricmodules assembled into another heat-exchange device;

FIG. 28 is a top view of the two thermoelectric modules mounted on asingle separable substrate for use in the above heat-exchange device;

FIG. 29 is a cross-section taken along line X—X of FIG. 28;

FIG. 30 is a partially sectional view of a further heat-exchange devicein which the two thermoelectric modules are arranged in the same plane;

FIG. 31 is top view of the two thermoelectric modules mounted on asingle separable substrate with individual circuits of the firstcontacts being interconnected by an extension bridge;

FIG. 32 is a cross-section taken along line X—X of FIG. 31;

FIG. 33 is a top view of another base plate which may utilized in thepresent invention;

FIG. 34 is a bottom view of the base plate of FIG. 33;

FIG. 35 is a cross-section taken along line X—X of FIG. 34;

FIG. 36 is a cross-section taken along line Y—Y of FIG. 34;

FIG. 37 is a top view of another base plate which may utilized in thepresent invention;.

FIG. 38 is a bottom view of the base plate of FIG. 37;

FIG. 39 is a cross-section taken along line X—X of FIG. 38;

FIG. 40 is a cross-section taken along line Y—Y of FIG. 38;

FIG. 41 is a perspective view of a thermoelectric module in accordancewith another preferred embodiment of the present invention;

FIG. 42 is a top view of a base plate utilized in the thermoelectricmodule of FIG. 41;

FIG. 43 is a bottom view of the base plate;

FIG. 44 is a cross-section taken along line X—X of FIG. 42;

FIG. 45 is a cross-section taken along line Y—Y of FIG. 42;

FIG. 46 is a cross-section taken along line Z—Z of FIG. 42;

FIG. 47 is a top view of a top plate shown with cut-away portions in asubsequent step of fabricating the thermoelectric module; and

FIG. 48 is a top view of the thermoelectric module shown with the topplate being removed.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

A thermoelectric module in accordance with one preferred embodiment ofthe present invention is now discussed herein. As show in FIG. 1, thethermoelectric module M is adapted in use to be held between a bottomlayer 130 and a top layer 140 and incorporated in a heat-exchange devicewhich includes a bed 150 with heat radiating fins 151 and an applicatorpanel 160. The applicator panel 160 is fixed to the bed 150 by means ofscrew 152 and is utilized as a heat-exchange surface for a cooling orheating purpose. The bottom layer 130 is made of a hard polymer havinggood thermal conductivity, while the top layer 140 is made of a gel,i.e., a jellylike dielectric polymer having good thermal conductivity inorder to absorb heat-stress developed at the interface betweenthermoelectric module M and the applicator panel 160.

As shown in FIGS. 2 to 6, the thermoelectric module M is composed of aplurality of thermoelectric chips of P-type and N-type 31 and 32 whichare arranged in a matrix to have more than two chip arrays eachextending along the column of the matrix and electrically connected inseries by means of first and second contacts 11 and 21 which aredisposed on opposite faces of the chips, respectively. Two adjacent onesof the first contacts 11 in each column are connected by first bridges12 to form first discrete couples 13 for electrical connection of thechips in each chip array. Likewise, two adjacent ones of the secondcontacts 21 in each column are connected by second bridges 22 to formsecond discrete couples 23. The chip arrays are interconnected byinter-array bridges 15 which are formed solely on the side of the firstcontacts to bridge the two adjacent first contacts 11 at the outermostrows of the matrix. Thus, the individual chip arrays are electricallyinterconnected through the inter-array bridges 15 while leaving thesecond discrete couples 23 completely isolated from each other on thetop side of the thermoelectric module M. In use, the first couples 13are fixedly supported by a dielectric rigid substrate 100 made of aceramic or resin to be restrained thereto. As shown in FIG. 1, the rigidsubstrate 100 is held on the bed 150 through the bottom layer 130, whilethe gel layer 140 is directly mounted on the second couples 23 under theapplicator panel 160. Since the second discrete couples 23 arecompletely isolated from each other and are thermally communicated withthe applicator panel only through the gel layer 160, the heat stressaccumulated on the thermoelectric module during the use can be wellrelieved on the top side thereof, protecting the module from undesiredbreakage or disconnection. A pair of terminal lugs 17 extendrespectively from the first contacts 11 at the ends of the two outermostcolumns for wiring connection to an external voltage source. By flowinga current in a selective direction to the circuit of the thermoelectricmodule, the top side of the module is cooled due to the Peltier effectat the chips, while the opposite side of the module is heated, or viseversa.

As shown in FIGS. 7 to 12, the above thermoelectric module is obtainedby cutting in a pre-assembly formed by a stack of a base plate 10, aplurality of thermoelectric bars of P-type and N-type 30, and a topplate 20. The base plate 10 is made of an electrically conductivematerial such as copper into a unitary structure from which the firstdiscrete couples 13 of the first contact 11 as well as the inter-arraybridge 15 are formed by the cutting. The top plate 20 is also made of anelectrically conductive material such as copper into a unitary structurefrom which the second discrete couples 23 of the second contacts 21 areformed by the same cutting. In detail and also with reference to FIGS.13 to 16, the base plate 10 is shaped to have six parallel blocks 14which are connected by the horizontally spaced first bridges 12, asshown in FIG. 13. Each block 14 is subsequently divided into a set ofthe first contacts 11 horizontally spaced along the row of the matrix.That is, the first contacts 11 are connected by first horizontal beam 16in the upper half of the block 14, as shown in FIG. 15. The twooutermost blocks 14 are further shaped to include the inter-array bridge15 interconnecting the two adjacent ones of the first contacts 11 in thelower half of the block 14, as shown in FIGS. 7 and 12. The first beams16 are aligned in five parallel paths along the column of the matrix todefine five cutting lines extending over the entire vertical length ofthe base plate 10. Cutting of the base plate 10 is made along thecutting lines to entirely remove the first beams 16 so as to separatethe first contacts 11 with respect to the horizontal direction, i.e.,along the rows of the matrix, while leaving the two vertically adjacentones of the first contacts 11 connected by the first bridges 12 formedin the lower half of the base plate 10. The terminal lugs 17 extend fromthe lower half of the one outer block 14 to remain after the cutting.

Also with reference to FIGS. 7 and 8, the top plate 20 is shaped to havethe second contacts 21 connected by second horizontal beams 26 such thatthe second couples 23 of the second contacts 21 in one column arestaggered to those in the adjacent column. The second contacts 21, thesecond bridges 22 forming the second couples 23, and the secondhorizontal beams 26 are of the same thickness and are disposed withinthe same plane. The second horizontal beams 26 are aligned along thefive parallel paths respectively in exact correspondence to the cuttinglines so that the second beams 26 are completely removed by the cuttingto provide the second discrete couples 23 totally separated from eachother. The base plate 10 and the top plate 20 can be shaped into theindividual configurations by press-forming, cutting, or etching theblank plates.

The pre-assembly of FIG. 8 is obtained by bonding the thermoelectricbars 30 of the different types on the blocks 14 of the base plate 10while arranging the bars of different types alternately in the columndirection, followed by bonding the top cover 20 on the bars 30 in exactregistration between the second beams 26 and the first beam 16 of thebase plate 10. Thereafter, the cutting is made along the cutting linesto divide the bars into the chips 31 and 32, and at the same time toseparate the first discrete couples 13 from each other as well as thesecond discrete couples 23 from each other. In this manner, only the onecutting process from one direction is sufficient to obtain thethermoelectric module M from the sub-assembly even with the use of thethermoelectric bars 30, the base plate 10 and the top plate 20 both ofunitary structure, thereby greatly facilitating the fabrication of thethermoelectric module.

In fact, the above fabrication method is particularly advantageous inproviding a plurality of the thermoelectric modules M in a continuousline, as shown in FIG. 17. This continuous process utilizes a first tape41 having a series of the base plates 10 connected by first webs 42 anda second tape 51 having a series of the top plate 20 connected by secondwebs 52. The first and second tapes 41 and 51 are unwound fromrespective rolls 40 and 50 and are fed in one direction in parallel witheach other during which the thermoelectric bars 30 are bonded to thebase plates 10 and the top plates 20 to form a series of thepre-assemblies. The pre-assemblies are then cut into individual skeletonstructures of the thermoelectric modules M by use of rotary cutters 54arranged along a direction perpendicular to the feeding direction.Thereafter, the skeleton structures of individual modules M are cutapart at the first and second webs. It is preferred to fill a dielectricresin 55 between the base plates 10 and the top plates 20 prior tocutting the pre-assemblies in order to protect the thermoelectric barsfrom being fractured at the time of cutting the bars into the chips.Thus obtained skeleton structure of the thermoelectric module M issupported on a dielectric substrate 100 made of alumina or the likesolid material backing the set of the first couples 13 of the firstcontacts 12 to securely hold the whole module. That is, the firstcouples 13 and the inter-array bridges 15 are bonded on the substrate100.

Alternately, the thermoelectric module M may be fabricated in a batchprocess in which a single module is obtained from pre-assembly formed ofthe stack of the base plate 10, the bars 30 and the top plate 20. Inthis process, the base plate 10 is supported on the like dielectricsubstrate 100 by bonding the bottoms of the base plate 10 to thesubstrate 100 so that the first beams 16 are spaced from the substrateto be successfully removed by the subsequent cutting without causing anyinterference with the substrate. The bonding of the base plate 10 ismade by for example, a so-called direct bonging copper (DBC) method inwhich the bottom of the base plate is partially transformed byapplication of heat to a copper oxide which is responsible for a strongbonding between the base plate and the substrate. Further, since thefirst bridges of the first contacts as well as the inter-array bridgesare held secured to the substrate, the subsequent cutting of the firstbeams can be made accurately and easily with the first contact kept inthe correct positions. It is noted in this connection that two or moremodules may be fabricated in a like batch process by utilizing acorresponding number of the base plates and the top plates which arecoupled by first and second joints, respectively into first and secondsheets. The thermoelectric bars are held between the two sheets to makethe plural stacks of the base plates, the thermoelectric bars, and thetop plates. Thereafter, the individual stacks are cut into theindividual modules which are then cut apart at the first and secondjoints. In this instance, only one cutting operation is sufficient forfabricating the modules from the pre-assemblies when the base plates andthe top plates are aligned, respectively.

As shown in FIGS. 18 to 20, the base plate 10A may be partially embeddedin a dielectric resin substrate 100A of molded plastic material to besecurely supported thereby. The plastic material may be thermosettingresin such as epoxy, phenol, and polyimide or thermoplastic resin suchas PPS, liquid crystal polymer, and polyetherketone. The first contacts11A project on top of the resin substrate 100A, but the first beam 16Amay be partly embedded in the resin substrate 100A so as to be removedtogether with the upper part of the substrate at the cutting. The bottomof the base plate 10A is made flush with the bottom of the resinsubstrate 100A so that the base plate 10A has its bottom totally exposedto give an exposed pattern of the same configuration as shown in FIG.16. Thus, the heat can be transferred from the base plate 10A to asupporting structure, e.g., the bed 150 of FIG. 1 without being hamperedby the resin substrate 10A.

FIGS. 21 to 23 show a modification in which a set of first contacts 11Bare supported on a dielectric substrate 100B together with the firstbridges 12B and the inter-array bridges 15B but without the first beam.Thus, the first discrete couples 13B are formed on the substrate withoutrequiring the subsequent cutting. The substrate 100B may be made ofalumina or the like solid material.

FIGS. 24 to 26 show another modification in which a set of firstcontacts 11C are partly embedded in a dielectric resin substrate 100Ctogether with the first bridges 12C as well as the inter-array bridges15C. No first beam is provided so that the first discrete couples 13Care exposed on the resin substrate 100C without requiring the subsequentcutting. The first contacts 11C and the associated parts are exposed onthe bottom of the resin substrate 100C.

As shown in FIG. 27, two thermoelectric modules M may be stacked to forma dual heat exchange device. For this application, it is advantageous tofabricate the two modules M on a single dielectric substrate 100D, asshown in FIGS. 28 and 29. The base plate or the first contacts 11D arebonded to the substrate prior to cutting the thermoelectric bars and thetop plate into the individual chips and the second discrete couples 23Dof the second contacts 21D. The pre-assemblies of the two modules M arearranged to align the cutting lines CL for requiring only one cuttingprocess when fabricating the two modules. The substrate 100D is formedwith a notched groove 101 intersecting the cutting lines for separatingthe two modules. Thus separated modules M are stacked as shown in FIG.27 while establishing electrical connections between the respectiveterminal lugs.

FIG. 30 shows a further heat-exchange device in which the twothermoelectric modules M are mounted in the same level between the bed150E and the applicator panel 160E. The two modules M can be formed on asingle dielectric substrate 100E with a notched groove 101E, as shown inFIGS. 31 and 32 and are separated subsequently at the notched groove101E. One of the terminal lugs 17E of each module is integrallyconnected by an extension bridge 18 which is capable of being deformedto allow the separated modules to rotate in the same plane relative toeach other. For this purpose, the extension bridge 18 is located at onecorner of the module M. The extension bridge 18 may be optionally cut togive two independent modules.

FIGS. 33 to 36 show a modified base plate 10F which may be equallyutilized in the present invention. The base plate 10F has a flat topsurface on which the first contacts 11F, the first bridges 12F and thefirst beams 16F are exposed, while the bottom surface of the base plate10F is concaved at portions corresponding to the first beams 16F. Thatis, the first bridge 12F has a thickness equal to that of the firstcontact 11F and connects the two adjacent first contacts within the sameplane, while the first beam 16F has a thickness less than that of thefirst contact 11F and has its top surface flush with the top surface ofthe first contact receiving the thermoelectric bar. The base plate 10Fof this configuration can be easily obtained by press-forming.

FIGS. 37 to 40 show a further modified base plate 10G which may be alsoutilized in the present invention. The base plate 10G is formed from ablank sheet of uniform thickness to give first contacts 11G by partiallycutting and bending the sheet. The resulting first contacts 11G areinterconnected by first bridges 12G of straight configuration to definerespective first discrete couples 13G. First beams 16G of straightconfiguration interconnects the first contacts 11G in the adjacentcolumns. The first contacts 11G at opposite ends of the column areconnected to those of the adjacent column by inter-array bridges 15Gwhich is also formed by partially cutting and bending the sheet. Thus,the base plate 10G can be easily prepared also by press-forming.

Although the above illustrated embodiment and its modifications all showan arrangement of using even number of the rows of the chips, thepresent invention is not limited thereto and may include an odd numberof the rows of the chips only by a slight design alternation for thearrangement of the first and second contacts.

FIGS. 41 to 48 show a thermoelectric module M in accordance with anotherpreferred embodiment of the present invention. The module M of thisembodiment includes a plurality of thermoelectric chips 31 and 32 ofdifferent types which are arranged in a matrix and are connected in anexact alternate sequence to form a series circuit without leaving anydirect connection of the chips of the same type as seen in the previousembodiment at connections by the inter-array bridges. The resultingcircuit is adapted to flow an electric current as indicated by arrowedline in FIG. 48. This embodiment utilizes a combination of a base plate110 and the top plate 120 of unique configurations so as to give threechip arrays each defined by the chips 31 and 32 arranged in a pair ofthe two adjacent rows of the matrix, the first contacts 111 in acorresponding pair of the two adjacent rows, and second contacts 121 ina corresponding pair of the two adjacent rows of the matrix, as shown inFIG. 48. The first contacts 111 in each row of the matrix are connectedto those on the adjacent row by means of first oblique bridges 112,while the first contacts 111 on the same row are integrally connected byfirst horizontal beams 116 which are subsequently cut away to give firstdiscrete couples 113 of the first contacts 112, as indicated by dottedlines in FIGS. 42 and 43. The three chip arrays are connected byinter-array bridges 115 extending between the two first contact 111 atends of the two oppose rows. The base plate 110 is also formed withfirst vertical beams 119 which interconnect the first horizontal beams116 at one ends of the adjacent rows opposite of the inter-array bridge115. A pair of terminal lugs 117 extend from the first contacts at theoutermost rows for electrical connection with a voltage source.

As shown in FIG. 47, the top plate 120 has a uniform thickness and isshaped to include three blocks each composed of two rows of secondcontacts 121. Each pair of the second contacts 121 across the two rowsare integrally connected by a second vertical bridge 122, while thesecond contacts 121 in each row are connected to each other by secondhorizontal beams 126 which are subsequently cut away together with thebars 30 and first beams 116 and 119 to give second discrete couples 123,as shown in FIGS. 41 and 47. The second couples 123 are aligned in thecolumn as well as in the row directions.

In the same fashion as in the previous embodiment, the module M isfabricated from a sub-assembly which is a stack of the base plate 110,thermoelectric bars, and the top plate 120. That is, portions indicatedby cross-hatched lines in FIG. 47 are cut away to remove the secondhorizontal beams 126, the first horizontal beams 116 as well as thefirst vertical beams 119, at the same time of cutting the bars into theindividual chips 31 and 32, thereby isolating the second discretecouples 123 on the top side of the module and isolating the firstdiscrete couples 113 on the bottom side of the module, while leaving theinter-array bridges 115 for electrical interconnection between firstcontacts of the adjacent chip arrays. For this purpose, the firstoblique bridges 112 and the inter-array bridges 115 are formed in thelower half of the base plate 110 to remain after the cutting, while thefirst horizontal beams 116 and the first vertical beams 119 are formedin the upper half of the base plate 110 to be cut away. The abovearrangement including the first couples 123 of the first contacts 121connected by the first oblique bridges 122 and the associated parts isfound advantageous also for the two chip arrays in a sense ofeliminating the direct connection of the chips of the same type at thejuncture of the chip arrays. It is noted at this time that thusfabricated module M may be also utilized in the heat-exchange devices asshown in FIGS. 1, 27, and 30. Although not shown in the figures, thebase plate 110 is held by a rigid dielectric substrate such as a ceramicsubstrate 100 or resin substrate 100A as utilized in the previousembodiment so that the first couples 130 are fixed or restrained by thedielectric substrate. The thermoelectric module M thus fabricated isincorporated in a heat-exchange device in a like fashion as shown inFIG. 1 with the rigid substrate held on a bed 150 through a bottom layer130 and with a gel layer 140 interposed between the second couples 123and an applicator panel 160. Further, the module M may be formed in acontinuous process as shown in FIG. 17. In this case, the substrate maybe bonded to the first couples 113 after making the simultaneous cuttingof the base plate, the top plate, and the thermoelectric bars.

What is claimed is:
 1. A thermoelectric module comprising: a pluralityof thermoelectric chips of P-type and N-type arranged in a matrixbetween a set of first contacts and a set of second contacts botharranged in said matrix to form a series connected electrical circuitwhich is adapted to flow an electric current therethrough in a selecteddirection for heating or cooling one side of the first and secondcontacts due to the Peltier effect at said chips, said chips beingarranged to give at least three chip arrays each having a limited numberof said chips, a first carrier carrying the set of said first contactsand including first bridges each integrally joining two adjacent firstcontacts to define first discrete couples for electrical connection ofsaid chips in each of said chip arrays; a rigid dielectric substratefixedly mounting said first carrier to restrain said first discretecouples to said substrate; and second bridges each integrally joiningthe two adjacent second contacts for electrical connection of the twoadjacent chips in each of said chip arrays on opposite side of saidfirst contacts; wherein said first carrier includes at least twointer-array bridges which are solely responsible for electricalinterconnection between the adjacent chip arrays, and wherein said twoadjacent ones of said second contacts connected by said second bridgesdefine individual second discrete couples which are isolated from eachother on opposite side of said first contacts.
 2. The thermoelectricmodule as set forth in claim 1, wherein each of said chip arrays isdefined by said chips, said first contacts, said second contacts, allarranged along each column of said matrix; said first bridges beingfirst vertical bridges each integrally joining the two adjacent firstcontacts in each column of said matrix to give said first discretecouples, said inter-array bridges joining the two adjacent firstcontacts in the outermost rows of said matrix to form horizontal couplesfor electrical interconnection between said adjacent chip arrays eacharranged along the columns of said matrix, said second bridges beingsecond vertical bridges each integrally joining the two adjacent secondcontacts in each column of said matrix to give said second discretecouples, said second discrete couples arranged along one column of saidmatrix being uniformly staggered with respect to said second discretecouples arrange along the adjacent column of said matrix.
 3. Thethermoelectric module as set forth in claim 1, wherein each of said chiparrays is defined by said chips arranged in a pair of the two adjacentrows of said matrix, said first contacts in a corresponding pair of thetwo adjacent rows of said matrix, and said second contacts in acorresponding pair of the two adjacent rows of said matrix; said firstbridges being first oblique bridges each integrally joining a pair oftwo obliquely opposed first contacts, one in the one row and the otherin the adjacent row of said first matrix to give said first discretecouples; said inter-array bridges each joining a pair of two verticallyopposed first contacts, one in the row of the chip array and the otherin the row of the adjacent chip array for electrical interconnectionbetween the adjacent chip arrays; said second bridges being secondvertical bridges each integrally joining the two adjacent secondcontacts in each column of said matrix to give said second discretecouples, said second discrete couples being aligned along the columns aswell as along said rows of said matrix.
 4. The thermoelectric module asset forth in claim 1, wherein said first carrier is supported on adielectric substrate which is adapted to install said thermoelectricmodule in a heat-exchange device, said second contacts being covered bya gel layer which is adapted to interpose between said thermoelectricmodule and a heating or cooling member.
 5. The thermoelectric module asset forth in claim 1, wherein said first carrier is molded in adielectric resin substrate with said first contacts exposed on saidresin substrate, said plastic substrate being adapted to install saidthermoelectric module in a heat-exchange device, said second contactsbeing covered by a gel layer which is adapted to interpose between saidthermoelectric module and a heat or cooling member.
 6. A thermoelectricheat-exchange device comprising a stack of at least two saidthermoelectric modules as defined in claim 1, wherein the first carrierof each said thermoelectric module is supported on a dielectricsubstrate, the dielectric substrate of the upper thermoelectric modulebeing superimposed on the sets of said second contacts of the lowerthermoelectric module.
 7. A thermoelectric heat-exchange devicecomprising at least two said thermoelectric modules as defined in claim1, wherein said thermoelectric modules are laterally spaced and retainedbetween a pair of heating and cooling members with said first carrier ofeach modules mounted on one of said heating and cooling members and withthe sets of the second contacts of each module kept in heat-conductiveengagement with the other of said heating and cooling members.
 8. Thethermoelectric heat-exchange device as set forth in claim 6 or 7,wherein the first carriers of the individual thermoelectric modules areelectrically interconnected by an extension bridge integrally formedwith said first carriers.
 9. The thermoelectric heat-exchange device asset forth in claim 8, wherein said extension bridge extends from thefirst contact at one corner of one of said thermoelectric modules to thefirst contact at one corner of the adjacent thermoelectric module.